This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.

中文翻译：

---

超薄芯片自动组装过程的可行性研究。

本文介绍了在标准自动组装机上自动超薄芯片的自动贴装工艺的可行性研究。迄今为止，尚缺乏有关厚度小于50 µm的超薄芯片自动组装的科学研究，但对于在狭小空间或灵活的智能医疗系统中进行具有成本效益的高产量薄膜系统生产，这是必不可少的应用于生物医学领域。制造了用于超薄芯片处理的新型取放工具，并开发了从热剥离箔片上分离芯片的工艺。在此基础上，开发了厚度为30 µm的超薄芯片的粘合工艺，并将其转移到自动组装机上。