Transient liquid phase (TLP) technique has excellent potential for producing bimetallic devices in medical applications. TLP bonding between Co–Cr–Mo and Ti–6Al–4V metallic biomaterials was carried out using copper interlayer with a thickness of 10 μm at the bonding temperature of 900, 920, 940, and 960 °C. The effect of bonding temperature on the microstructural and mechanical characteristics was investigated. The results showed that the increase in the bonding temperature leads to the enlargement of the interfacial brazing zone (IBZ). Also, the reactive layer width is enlarged due to the increase in the eutectic liquid volume. Several intermetallic compounds such as Ti(Co, Cu), Ti₂(Co, Cu), and CoCr(Ti, Mo) are identified in the IBZ. The bonded joint at 920 °C has the maximum strength equal to 277 MPa. The cleavage pattern dominates on the fracture surfaces owing to the formation of brittle phases in the dissimilar joints. The diffusion layer of the Co–Cr–Mo base metal has the highest hardness in the IBZ.

瞬态液相（TLP）技术在医疗应用中具有生产双金属器件的巨大潜力。Co-Cr-Mo和Ti-6Al-4V金属生物材料之间的TLP粘结是在900、920、940和960°C的粘结温度下使用厚度为10μm的铜夹层进行的。研究了键合温度对组织和力学性能的影响。结果表明，键合温度的升高导致界面钎焊区（IBZ）的扩大。而且，由于低共熔液体体积的增加，反应层宽度增大。几种金属间化合物，例如Ti（Co，Cu），Ti ₂（Co，Cu）和CoCr（Ti，Mo）在IBZ中标识。920°C的粘结接头的最大强度等于277 MPa。由于在异种接头中形成脆性相，因此在断裂表面上劈裂模式占主导。Co-Cr-Mo基金属的扩散层在IBZ中具有最高的硬度。