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Assessing the thermal degradation of bonded joints in flat ceramic tiles of building facades by numerical and experimental dynamic analysis
Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications ( IF 2.5 ) Pub Date : 2020-06-02 , DOI: 10.1177/1464420720928569
Carla MV Lopes 1 , Luís Silva 2 , Pedro Sequeira 2 , Francisco Q de Melo 1
Affiliation  

Flat ceramic tiles are widely used as protective and aesthetic construction elements in urban building facades. Under the effect of extreme temperatures from the weather seasonality, bonded joints of these tiles undergo thermal cycle’s loads. In this work, a dynamic technique based on vibration metrology is implemented. This procedure consists in the analysis of accelerograms obtained in bonded ceramic tiles from low-intensity impact loads. A corresponding study carried out with finite element modelling allowed an accurate calibration of mechanical parameters of the tile/adhesive pair as well as the estimation of a vibration dissipation factor. Several test specimens subjected to a defined period of thermal cycles stressing were also analysed for the mentioned accelerogram and an expression for the ageing estimation of the mechanical properties of the bonded joints in the tiles was obtained.

中文翻译:

通过数值和实验动态分析评估建筑外墙平面瓷砖粘结接头的热降解

平面瓷砖被广泛用作城市建筑立面的保护性和审美性建筑元素。在天气季节性极端温度的影响下,这些瓷砖的粘合接缝会承受热循环载荷。在这项工作中,实现了一种基于振动计量的动态技术。该程序包括分析在低强度冲击载荷下从粘合瓷砖中获得的加速度图。使用有限元建模进行的相应研究允许精确校准瓷砖/粘合剂对的机械参数以及振动耗散因子的估计。
更新日期:2020-06-02
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