Printed conductors are the main building blocks of printed flexible electronic circuits. With the advancement and growing demand for printed and flexible electronics, researchers are focused on assessing the mechanical reliability of interconnects. Even more important is, often, the electrical performance or the current‐carrying capacity of the interconnects. A mechanically reliable interconnect has limited use if it cannot meet the current‐carrying requirements. However, current‐carrying capacity curves and circuit design guidelines such as those available for conventional copper conductors have not yet been established for printed interconnects, i.e., there is a technological gap in this domain. The present work focuses on assessing the maximum allowed current through an aerosol jet printed silver nanoparticle‐based conductor on a 75 μm thick polyimide substrate. The temperature coefficient of resistance for the printed ink is experimentally determined. The effect of printed ink microstructure on the temperature coefficient of resistance is also investigated. Standard curves are generated that would guide designers to determine the trace width required for an allowed temperature increase. Furthermore, the effect of sintering temperature on the current‐carrying capability is evaluated.

中文翻译：

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评估气溶胶喷射印刷导线的载流能力

印刷导体是印刷柔性电子电路的主要组成部分。随着印刷和柔性电子技术的发展和需求的增长，研究人员将重点放在评估互连的机械可靠性上。通常，更重要的是互连的电气性能或载流量。如果机械可靠性高的互连不能满足载流要求，则使用范围有限。但是，尚未为印刷互连建立载流能力曲线和电路设计指南，例如可用于常规铜导体的载流曲线和电路设计指南，即在此领域存在技术空白。本工作着重于评估通过75μm厚的聚酰亚胺基板上的气溶胶印刷银纳米颗粒基导体的最大允许电流。通过实验确定印刷油墨的电阻温度系数。还研究了印刷油墨的微观结构对电阻温度系数的影响。生成标准曲线，这些曲线将指导设计人员确定允许的温度上升所需的走线宽度。此外，评估了烧结温度对载流能力的影响。生成标准曲线，这些曲线将指导设计人员确定允许的温度上升所需的走线宽度。此外，评估了烧结温度对载流能力的影响。生成标准曲线，这些曲线将指导设计人员确定允许的温度上升所需的走线宽度。此外，评估了烧结温度对载流能力的影响。