We developed and investigated highly stretchable conductive inks for three-dimensional in-mold electronics technology, which enables injection molding and installation of electronic circuits and optical devices with hard coating lamination through a one-step process. Ag was selected as a conductive filler, and we combined Ag particles of various shapes, including nanowires. Highly stretchable binders with excellent miscibility in the conductive filler combinations were formulated well. A fluorine rubber binder with high electronegativity generated new Ag nanoparticles through heat treatment, resulting in higher electrical conductivity. After the formulation of the stretchable conductive inks, circuit patterns were screen-printed precisely, and a one-step injection molding process was conducted. It was noted that, after a high-temperature, high-pressure in-mold electronics process, the conductive fillers of the ink circuits were tightly packed, resulting in a considerable increase in their electrical conductivity. The highly stretchable conductive ink with Ag nanowireFR-2, constituting the circuits of the in-mold electronics product, exhibited a conductivity of 17.416 kS/cm even under a design strain of 4.77%.

我们开发和研究了用于三维模内电子技术的高拉伸性导电油墨，该油墨能够通过一步法注塑成型并安装具有硬涂层层压的电子电路和光学设备。Ag被选作导电填料，我们将包括纳米线在内的各种形状的Ag颗粒结合在一起。在导电填料组合物中具有极好的可混溶性的高拉伸性粘结剂配制得很好。具有高电负性的氟橡胶粘合剂通过热处理产生了新的Ag纳米颗粒，从而提高了电导率。配制可拉伸导电油墨后，精确丝网印刷电路图案，然后进行一步注模成型工艺。据指出，高温后，在高压模内电子工艺中，墨路的导电填料被紧密包装，导致其电导率显着提高。构成模内电子产品电路的具有Ag纳米线FR-2的高拉伸性导电油墨，即使在设计应变为4.77％的情况下，其导电率仍为17.416 kS / cm。