As electronic devices have become smaller, the importance of heat dissipation has grown. Therefore, to contribute to heat emission reduction efforts, we investigated the thermal diffusivity of Ag/CNT added to Ag matrix and compared it to that of pure Ag. The composite consisted of 99 wt% Ag and 1 wt% Ag/CNT. All samples, including the pure Ag sample, were densified via 10-min spark plasma sintering at 600 °C and 100 MPa. The morphological analysis of the samples was performed using SEM and TEM and their microstructure was derived through XRD. Two different thermal diffusivities were determined via the laser flash method. The remarkable increase in thermal diffusivity, even with the addition of as little as 1% of Ag/CNT, clearly shows that this is a feasible solution to the problem of heat dissipation in electronic devices.

随着电子设备变得越来越小，散热的重要性越来越高。因此，为有助于减少热量排放，我们研究了添加到Ag基体中的Ag / CNT的热扩散率，并将其与纯Ag的热扩散率进行了比较。该复合物由99重量％的Ag和1重量％的Ag / CNT组成。通过在600°C和100 MPa下进行10分钟的火花等离子体烧结，将包括纯银样品在内的所有样品致密化。使用SEM和TEM进行样品的形态分析，并通过XRD得出其微观结构。通过激光闪光法确定两种不同的热扩散率。即使仅添加1％的Ag / CNT，热扩散率的显着提高也清楚地表明，这是解决电子设备散热问题的可行方案。