ABSTRACT

This paper presents the role of surface roughness on the bacterial adhesion to the food-grade AISI 316L stainless steel surface, which was prepared by the mechanical and electrochemical polishing processes. Escherichia coli or E. coli was the bacteria tested in this study as it is a sanitization indicator in the food and pharmaceutical industries. The average surface roughness (R_a), peak-to-valley roughness (R_y), and five-point average roughness (R_z) of the polished surface were measured, and the results demonstrated that the amount of E. coli was found to increase with the increased surface roughness. As per the electrochemical polishing process, the effects of applied voltage, electrolyte concentration, and polishing time on the three roughness parameters were examined. Besides the R_a, the influence of R_y and R_z on the bacterial adhesion was found to be very significant. By using the electrochemical process with a suitable polishing condition, the R_y and R_z were substantially reduced compared to the mechanically polished surface with the similar level of R_a. The amount of bacteria on the electrochemically polished surface was also lower than the mechanical one by 25% on average.

摘要

本文介绍了表面粗糙度对通过机械和电化学抛光工艺制备的食品级 AISI 316L 不锈钢表面细菌粘附的作用。大肠杆菌或大肠杆菌是本研究中测试的细菌，因为它是食品和制药行业的消毒指标。测量了抛光表面的平均表面粗糙度（R _a）、峰谷粗糙度（R _y）和五点平均粗糙度（R _z），结果表明大肠杆菌的含量发现随着表面粗糙度的增加而增加。根据电化学抛光过程，研究了施加电压、电解液浓度和抛光时间对三个粗糙度参数的影响。除了R _{a 之外}，发现R _y和R _z对细菌粘附的影响非常显着。通过在合适的抛光条件下使用电化学工艺，与具有相似R _a水平的机械抛光表面相比，R _y和R _z显着降低. 电化学抛光表面的细菌数量也比机械抛光表面平均低 25%。