This paper presents the modification of wettability by nanosecond laser surface textured followed by silanization to fabricate the superhydrophobic zirconia surface. Surface modification by varying the pitch between channels leads to micro‐channel and micro‐grid pattern with different surface roughness. The generated morphological and metallurgical modifications of the surface are measured by scanning electron microscopy (SEM) and X‐ray photoelectron spectroscopy (XPS). Numerous micro‐pits and cracks in the laser‐treated areas can be observed from SEM, which indicates crack propagation dominating the process of laser ablation of zirconia. The surface is superhydrophilic with laser‐texturing instantly, whose wettability is modified over time. By analyzing the XPS, carbon content, especially C‐C (H) groups, is important for the time‐dependent wettability. The hydrophobicity of all laser‐textured surfaces is improved after silanization. Laser texturing with smaller pitch (50 μm and 70 μm) leads to superhydrophobic surfaces after silanization, which may be due to the modification of physicochemical properties of substrate by very rapid local heating and cooling on the thick surface layer. Overall, the investigations indicate that wettability modifications can be attributed to the surface's microstructure, which depend on laser processing parameters, and chemical composition, especially in terms of −CF₃, −CF₂, and C‐C (H).

中文翻译：

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激光表面织构和硅烷化改性氧化锆的润湿性

本文介绍了纳秒级激光表面纹理化处理，然后进行硅烷化处理以制造超疏水氧化锆表面的方法，从而改善了润湿性。通过改变通道之间的间距进行表面改性会导致具有不同表面粗糙度的微通道和微网格图案。通过扫描电子显微镜（SEM）和X射线光电子能谱（XPS）测量生成的表面形态和冶金修饰。从扫描电镜可以看到在激光处理过的区域有许多微坑和裂纹，这表明裂纹扩展在氧化锆激光烧蚀过程中占主导地位。该表面具有超亲水性，可立即进行激光纹理处理，其润湿性会随着时间而改变。通过分析XPS，碳含量，尤其是C（H）基，对于随时间变化的润湿性很重要。硅烷化后，所有具有激光纹理的表面的疏水性均得到改善。较小间距（50μm和70μm）的激光纹理化在硅烷化后会形成超疏水表面，这可能是由于通过在较厚的表面层上进行非常快速的局部加热和冷却而改变了基材的物理化学性质。总的来说，研究表明，润湿性的改变可归因于表面的微观结构，这取决于激光加工参数和化学成分，特别是在-CF方面 这可能是由于在厚表面层上进行非常快速的局部加热和冷却而改变了基材的物理化学性质。总的来说，研究表明，润湿性的改变可归因于表面的微观结构，这取决于激光加工参数和化学成分，特别是在-CF方面 这可能是由于在厚表面层上进行非常快速的局部加热和冷却而改变了基材的物理化学性质。总的来说，研究表明，润湿性的改变可归因于表面的微观结构，这取决于激光加工参数和化学成分，特别是在-CF方面₃，-CF ₂和C–C（H）。