A novel gradient thermoelectric microwave power sensor is designed to improve the performance in this work. The thermocouples are designed with different lengths based on the thermal distribution of resistance. It is fabricated using GaAs MMIC technology, and it can be integrated with other planar circuit structures. The thermal distribution of the gradient thermoelectric microwave power sensor is simulated by ANSYS finite element software. The performances of the gradient thermoelectric microwave power sensors are measured. The result shows that return loss is better than − 25 dB at 8–12 GHz. It reveals that this structure has a low reflection loss and a good matching characteristic. The sensitivity is 9.6 mV/W@8 GHz, 8.7 mV/W@10 GHz and 7.8 mV/W@12 GHz, respectively, and an excellent linear relationship of the output voltage with the input microwave power is obtained. Therefore, this optimized design of thermocouples has certain reference value for thermoelectric microwave power sensors.

设计了一种新颖的梯度热电微波功率传感器来改善这项工作的性能。根据电阻的热分布，将热电偶设计为不同的长度。它使用GaAs MMIC技术制造，并且可以与其他平面电路结构集成。梯度热电微波功率传感器的热分布通过ANSYS有限元软件进行仿真。测量了梯度热电微波功率传感器的性能。结果表明，在8–12 GHz时，回波损耗优于− 25 dB。揭示了该结构具有低反射损耗和良好的匹配特性。灵敏度分别为9.6 mV / W @ 8 GHz，8.7 mV / W @ 10 GHz和7.8 mV / W @ 12 GHz，并且获得了输出电压与输入微波功率的极好的线性关系。因此，这种优化的热电偶设计对热电微波功率传感器具有一定的参考价值。