A new Ni–Cr–Si–B–Fe filler material is prepared for transient liquid-phase (TLP) bonding of Inconel 718 superalloy by mechanical alloying technique. The melting temperature range of the filler material and its activation energy of melting are determined by differential scanning calorimetry technique. The activation energy and melting temperature of the alloy powder decrease with increasing milling time. Inconel 718 alloy was joined via TLP by using the newly developed filler material. The effect of TLP bonding temperature and time on microstructural evolution and mechanical properties of the joint was investigated. Three distinct microstructural regions were observed in the bonding area: isothermal solidification zone consisting of a single-phase solid solution, diffusion affected zone consisting of extensive diffusion-induced precipitates of metallic boride, and unaffected base material. The ultimate shear strength and microhardness of the TLP-bonded joint increase with bonding time and temperature.

一种新的Ni-Cr-Si-B-Fe填充材料是通过机械合金化技术制备的，用于Inconel 718高温合金的瞬时液相（TLP）键合。填充材料的熔融温度范围及其熔融活化能通过差示扫描量热技术确定。合金粉的活化能和熔化温度随研磨时间的增加而降低。使用最新开发的填充材料，通过TLP连接Inconel 718合金。研究了TLP键合温度和时间对接头微观组织演变和力学性能的影响。在结合区域观察到三个不同的微观结构区域：等温凝固区，由单相固溶体组成；扩散影响区，由广泛的扩散诱导的金属硼化物沉淀和未受影响的基础材料组成。TLP粘结接头的极限剪切强度和显微硬度随粘结时间和温度的增加而增加。