A novel silicon-containing phthalonitrile monomer named bis(4-(4′-(4′-phenoxy)phenyl)phenyl)dimethylsilane phthalonitrile (SiBPPN) was successfully designed and synthesized. The chemical structure was characterized by proton nuclear magnetic resonance and Fourier transform infrared (FTIR) analyses, and its molecular weight was determined by mass spectrometry. Its melting point is lower than that of 4,4′-bis(3,4-dicyanophenoxy)biphenyl (BPPN), which has no silicon atom, and its solubility is also much better than that of BPPN. The curing behavior of SiBPPN was studied by differential scanning calorimetry and FTIR analyses in detail. The thermal and thermomechanical properties of the polymer and laminate were studied by thermogravimetric analysis and dynamic mechanical analysis. The results show that the cured SiBPPN (c-SiBPPN) possesses excellent thermal and mechanical properties. Under nitrogen atmosphere, its residual weight ratio at 800°C is 81.5% and the 5% thermal degradation temperature is 546°C. In addition, quartz-fiber (QF)-reinforced c-SiBPPN composites exhibit mechanical properties superior to those of QF-reinforced cured BPPN composites. The interlaminar shear strength and bending strength of the composite are 30.44 and 389 MPa at room temperature, and the interlaminar shear strength and bending strength of the composite are 22.25 and 339 MPa at 300°C.

中文翻译：

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新型含硅邻苯二甲腈树脂及其石英纤维增强复合材料的合成与性能

成功设计并合成了一种新型含硅邻苯二甲腈单体双（4-（4'-（4'-苯氧基）苯基）苯基）二甲基硅烷邻苯二甲腈（SiBPPN）。通过质子核磁共振和傅里叶变换红外 (FTIR) 分析表征其化学结构，并通过质谱法确定其分子量。其熔点低于不含硅原子的4,4'-双(3,4-二氰基苯氧基)联苯(BPPN)，溶解性也远优于BPPN。通过差示扫描量热法和 FTIR 分析详细研究了 SiBPPN 的固化行为。通过热重分析和动态力学分析研究了聚合物和层压板的热和热机械性能。结果表明，固化后的 SiBPPN (c-SiBPPN) 具有优异的热性能和机械性能。在氮气气氛下，其800℃残重率为81.5%，5%热降解温度为546℃。此外，石英纤维 (QF) 增强的 c-SiBPPN 复合材料的机械性能优于 QF 增强的固化 BPPN 复合材料。复合材料的层间剪切强度和弯曲强度在室温下分别为30.44和389 MPa，复合材料在300°C下的层间剪切强度和弯曲强度分别为22.25和339 MPa。石英纤维 (QF) 增强的 c-SiBPPN 复合材料的机械性能优于 QF 增强的固化 BPPN 复合材料。复合材料的层间剪切强度和弯曲强度在室温下分别为30.44和389 MPa，复合材料在300°C下的层间剪切强度和弯曲强度分别为22.25和339 MPa。石英纤维 (QF) 增强的 c-SiBPPN 复合材料的机械性能优于 QF 增强的固化 BPPN 复合材料。复合材料的层间剪切强度和弯曲强度在室温下分别为30.44和389 MPa，复合材料在300°C下的层间剪切强度和弯曲强度分别为22.25和339 MPa。