Two types of thermosetting polyimide (PI) resin were prepared using a polymerization monomeric reactant method, and high performance PI fabric/PI resin composites were fabricated through a wet infiltration and thermoforming process. The properties of a PI fabric, PI resin, and PI/PI composites were comprehensively analyzed. The experimental results indicate that a resin end-capped with phenylacetylene achieves a better processability and heat resistance. The two composites exhibit excellent thermal, mechanical, and dielectric properties. They achieve a glass transition temperature of higher than 320°C and a 5% weight loss temperature of over 600°C under an air atmosphere. During mechanical testing, an interlaminar shear strength exceeding 35 MPa was achieved, whereas the maximum flexural strength was found to be greater than 400 MPa. Moreover, their dielectric constant at 1 MHz was below 3.4, with a dielectric loss of no more than 0.01.

中文翻译：

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具有优异热、机械和介电性能的聚酰亚胺织物增强聚酰亚胺基复合材料

采用聚合单体反应法制备了两种类型的热固性聚酰亚胺（PI）树脂，并通过湿法渗透和热成型工艺制备了高性能 PI 织物/PI 树脂复合材料。综合分析了 PI 织物、PI 树脂和 PI/PI 复合材料的性能。实验结果表明，苯乙炔封端的树脂具有更好的加工性能和耐热性。这两种复合材料表现出优异的热、机械和介电性能。它们在空气气氛下实现了高于 320°C 的玻璃化转变温度和超过 600°C 的 5% 失重温度。在机械测试期间，实现了超过 35 MPa 的层间剪切强度，而发现最大弯曲强度大于 400 MPa。而且，