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Flexible Reduced Graphene Oxide/Polyacrylonitrile Dielectric Nanocomposite Films for High-Temperature Electronics Applications
ACS Applied Nano Materials ( IF 5.3 ) Pub Date : 2020-06-22 , DOI: 10.1021/acsanm.0c01328
Yaotian Su 1 , Wenqing Zhang 1 , Jinle Lan 1 , Gang Sui 1 , Hongtao Zhang 2 , Xiaoping Yang 1
Affiliation  

Polymer dielectrics possess excellent flexibility compared with inorganic ceramic materials. However, the relatively low dielectric constant and working temperature significantly constrain their widespread application. Here, we report a low-cost facile strategy to develop flexible polymer-based composite films with high dielectric constant over a broad temperature. Polyacrylonitrile (PAN) nanofiber mats containing graphene oxide (GO) with core–shell microstructure were first prepared via coaxial electrospinning and then hot-pressed into dense composite films. It was revealed that hot-pressing assisted by a stretching force under appropriate temperature and pressure can generate local conformational changes of PAN, leading to the formation of an electroactive phase with increased dielectric constant. Meanwhile, the GO transformed into reduced graphene oxide (rGO) under heat reduction, serving as conductive nanofillers to further promote the increase of dielectric constant. Consequently, the optimized rGO/PAN composites displayed thermally stable dielectric properties with a high dielectric constant (ε′ = 23, 80 °C; ε′ = 40, 150 °C) and low loss (tan δ = 0.13, 80 °C; tan δ = 0.55, 150 °C) over a broad temperature range. This work offers an efficient method for the synthesis of flexible composite dielectric films that hold great potential in high-temperature electronic applications.

中文翻译:

高温电子应用的柔性还原氧化石墨烯/聚丙烯腈介电纳米复合薄膜

与无机陶瓷材料相比,聚合物电介质具有出色的柔韧性。但是,相对较低的介电常数和工作温度极大地限制了它们的广泛应用。在这里,我们报告了一种低成本的简便策略,以开发在宽温度下具有高介电常数的柔性聚合物基复合膜。首先通过同轴电纺丝制备含有核壳微结构的氧化石墨(GO)的聚丙烯腈(PAN)纳米纤维毡,然后将其热压成致密的复合膜。揭示了在适当的温度和压力下通过拉伸力辅助的热压可产生PAN的局部构象变化,从而导致形成具有增加的介电常数的电活性相。与此同时,GO在热还原下转变为还原型氧化石墨烯(rGO),作为导电纳米填料进一步促进介电常数的增加。因此,优化的rGO / PAN复合材料显示出具有高介电常数(ε'= 23,80°C;ε'= 40,150°C)和低损耗(tanδ= 0.13,80°C; tanδ= 0.55,150°C)在较宽的温度范围内。这项工作为合成柔性复合介电膜提供了一种有效的方法,该膜在高温电子应用中具有巨大潜力。ε'= 40,150°C)和低损耗(tanδ= 0.13,80°C; tanδ= 0.55,150°C)在较宽的温度范围内。这项工作为合成柔性复合介电膜提供了一种有效的方法,该膜在高温电子应用中具有巨大潜力。ε'= 40,150°C)和低损耗(tanδ= 0.13,80°C; tanδ= 0.55,150°C)在较宽的温度范围内。这项工作为合成柔性复合介电膜提供了一种有效的方法,该膜在高温电子应用中具有巨大潜力。
更新日期:2020-07-24
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