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Compact K/Ka‐band dipole antenna element with ball grid array packaging
Microwave and Optical Technology Letters ( IF 1.0 ) Pub Date : 2020-06-20 , DOI: 10.1002/mop.32510
Xiubo Liu 1 , Wei Zhang 1 , Dongning Hao 1 , Yanyan Liu 2
Affiliation  

A compact K/Ka‐Band dipole antenna element with ball grid array packaging is proposed. The antenna is divided into two parts, one is a cuboid antenna element fabricated on a FR4 printed circuit board, and the other is a grounded coplanar waveguide feed line fabricated on a motherboard. To minimize the size of the antenna element, we use three‐dimensional structure to design the antenna element. The dipole patches are fabricated on the top layer of the antenna element, and the ball grid array is on the bottom layer of the antenna element. Plated through holes connect solder balls and dipole patches. Finally, the antenna element is mounted on the motherboard. We designed, manufactured and measured the antenna prototypes. The details of the antenna design and the measurement results are presented and discussed.

中文翻译:

紧凑的K / Ka波段偶极子天线元件,带球栅阵列包装

提出了带有球栅阵列封装的紧凑型K / Ka-Band偶极天线元件。天线分为两部分,一个是在FR4印刷电路板上制造的长方体天线元件,另一个是在母板上制造的接地共面波导馈线。为了最小化天线元件的尺寸,我们使用三维结构来设计天线元件。偶极子贴片制作在天线元件的顶层,球栅阵列位于天线元件的底层。镀通孔连接焊球和偶极子贴片。最后,将天线元件安装在主板上。我们设计,制造和测量了天线原型。介绍并讨论了天线设计的细节和测量结果。
更新日期:2020-06-20
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