Abstract A series of copolyimides (CPIs) containing non-coplanar alicyclic units combined with fluorinated or rigid aromatic monomer segments is synthesized. The solid film samples display an elevated heat resistance as their degradation started at temperatures around 415 °C. Introduction into CPI backbone of bicyclic units, aromatic/aliphatic rings, angular bonds and/or low polarizable groups, determine the variation of the dielectric constant in the range 2.44–3.04 at 100 Hz. When using these CPIs as interlayer dielectrics (ILDs), it is revealed that resistance-capacitance delay is minimized (∼10−11 s) determining faster response of the device. Atomic force microscopy scans of CPI samples show distinct macromolecular architectures, all containing nanopores with features depending on the chemical structure. Interfacial adhesion of investigated ILDs with copper wiring is highest for the samples lacking fluorine groups.

中文翻译：

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基于包含非共面脂环单元的共聚酰亚胺的层间电介质，用于多级高速电子设备

摘要 合成了一系列含有非共面脂环单元与氟化或刚性芳族单体链段的共聚酰亚胺（CPI）。固体薄膜样品显示出较高的耐热性，因为它们在 415 °C 左右的温度下开始降解。将双环单元、芳香族/脂肪族环、角键和/或低极化基团引入 CPI 主链，确定了 100 Hz 下介电常数在 2.44–3.04 范围内的变化。当使用这些 CPI 作为层间电介质 (ILD) 时，发现电阻-电容延迟被最小化（~10-11 秒），这决定了器件的更快响应。CPI 样品的原子力显微镜扫描显示出不同的大分子结构，所有结构都包含纳米孔，其特征取决于化学结构。