Abstract Microelectronic packages continue to become smaller and more complex. Interfacial delamination is a common failure mechanism present in microelectronic packages due to the mismatch in the coefficient of thermal expansion (CTE) between different materials. Epoxy Molding Compound (EMC)/copper is a common interface found in microelectronic packages and is susceptible to delamination due to CTE mismatch. This work analyzes interfacial delamination of an EMC/copper interface and the impact of temperature and humidity conditioning on interfacial fracture energy using a double cantilever beam test. The critical interfacial fracture energy is obtained for as-received, thermally-aged, and humidity-conditioned samples. These experimental results can be used in models to predict delamination in an EMC/copper interface and how these interfaces are affected by factors such as time, temperature, and humidity conditioning.

中文翻译：

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温度和湿度条件对铜引线框架/模塑料界面分层的影响

摘要 微电子封装不断变得更小和更复杂。由于不同材料之间的热膨胀系数 (CTE) 不匹配，界面分层是微电子封装中常见的故障机制。环氧树脂模塑料 (EMC)/铜是微电子封装中常见的界面，容易因 CTE 不匹配而分层。这项工作使用双悬臂梁测试分析了 EMC/铜界面的界面分层以及温度和湿度条件对界面断裂能的影响。临界界面断裂能是针对原样、热老化和湿度条件下的样品获得的。