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Pre- and post-TLP bond solution treatments: Effects on the microstructure and mechanical properties of GTD-111 superalloy
Journal of Manufacturing Processes ( IF 6.1 ) Pub Date : 2020-06-21 , DOI: 10.1016/j.jmapro.2020.06.011
Danesh Amiri , Seyed Abdolkarim Sajjadi , Ata Kamyabi-Gol

This paper addresses the effects of bonding time and standard solution treatment on the microstructure and mechanical properties of GTD-111 superalloy bonded by transient liquid phase (TLP) using a Ni-7.58Cr-3.42Fe-3.6Si-2.95B amorphous interlayer. In this regard, three different heat treatment cycles namely HTsingle bondA, HTB and HTCsingle bondsingle bond were applied to separate TLP joints. In the HT-A cycle, full-solution annealing (1200 °C/4 h) of the base metal was first carried out followed by TLP bonding at 1120 °C/105 min, partial solution annealing (1120 °C/2 h) and finally aging treatment (845 °C/24 h). In the HTBsingle bond cycle, the first step was TLP bonding for 105 min at 1120 °C followed by full-solution, partial solution and aging heat treatments. Finally, the HTsingle bondC cycle was similar to the HTsingle bondB cycle except for the TLP bonding process which was performed at 1120 °C/15 min. The results indicated that HTsingle bondB treatment leads to a more uniform microstructure in the bond area and base metal compared to the microstructure obtained from HTsingle bondA and HTCsingle bond samples. Mechanical testing results indicated that a completely uniform hardness profile, similar to the base metal, was perceived in the bond region in the HTsingle bondB sample. The highest joint shear strength among all of the samples was obtained for the HTsingle bondB sample.



中文翻译:

TLP粘结前后的处理:对GTD-111高温合金的组织和力学性能的影响

本文研究了粘合时间和标准固溶处理对使用Ni-7.58Cr-3.42Fe-3.6Si-2.95B非晶夹层通过瞬态液相(TLP)粘合的GTD-111高温合金的组织和力学性能的影响。在这方面,将三个不同的热处理周期(即HT 单键A,HTB和HTC 单键单键)应用于单独的TLP接头。在HT-A循环中,首先对母材进行全固溶退火(1200°C / 4 h),然后在1120°C / 105 min进行TLP粘合,然后进行部分固溶退火(1120°C / 2 h)。最后进行时效处理(845°C / 24 h)。在HTB单键循环中,第一步是在1120°C下进行TLP粘结105分钟,然后进行全固溶,部分固溶和时效热处理。最后,HT 单键C循环类似于HT单键B循环,除了在1120℃/ 15分钟下进行的TLP粘结过程。结果表明,单键与从HT 单键A和HTC单键样品获得的微观结构相比,HT B处理导致结合区域和贱金属的微观结构更加均匀。机械测试结果表明,在HT 单键B样品的结合区域中观察到与母材相似的完全均匀的硬度分布。对于HT 单键B样品,获得了所有样品中最高的联合剪切强度。

更新日期:2020-06-21
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