The present study reports a processing route to recover metals from integrated circuits of discarded random access memory (RAM) units containing ~ 66% printed circuit boards and ~ 33% integrated circuits. The integrated circuits are manually separated, grounded, classified, and subjected to water fluidization for the effective separation of metals. The significant separation was achieved via water fluidization, and the underflow fraction was magnetically separated. The magnetic fraction was thermally exposed in a muffle furnace, and the process optimization was carried out using a Box-Behnken statistical design. The detailed characterization at subsequent steps significantly aids the understanding of metal-plastic separation and enrichment. A concentrate containing 97% metals (Fe-59%, Ni-9.5%, Cu-7.7%, Sn-13.4%, Pb-5.6%, Ag-1.6%) with 96 wt% recovery can be recovered from discarded IC units. The process pursued is simple, adaptable, and environment-friendly, and the product can be used in conventional smelters.

中文翻译：

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从废弃集成电路中回收金属

本研究报告了一种从包含约 66% 印刷电路板和约 33% 集成电路的废弃随机存取存储器 (RAM) 单元的集成电路中回收金属的处理路线。集成电路经过人工分离、接地、分级、水流化，有效分离金属。显着的分离是通过水流化实现的，底流部分被磁力分离。磁性部分在马弗炉中热暴露，并使用 Box-Behnken 统计设计进行工艺优化。后续步骤的详细表征极大地有助于理解金属-塑料分离和富集。含有 97% 金属的精矿（Fe-59%、Ni-9.5%、Cu-7.7%、Sn-13.4%、Pb-5.6%、Ag-1。6%) 和 96 wt% 的回收率可以从废弃的 IC 单元中回收。所追求的工艺简单、适应性强、环保，产品可用于常规冶炼厂。