A novel compact millimeter-wave system on package (SOP) module is proposed in this paper. To achieve high integration, the 14 layers substrate of module is fabricated with low temperature co-fired ceramic (LTCC) technology, which is advanced in incorporating the passive components in multi-layers, thus realizing the signal vertical propagation for the SOP. The designed SOP covering 30∼40 GHz is the core module for the millimeter-wave radar system. When the transmitting state of the system is initiated, the introduced SOP will up mix input intermediate frequency (IF) signal with local signal (LO) to millimeter-wave band. And the received millimeter-wave signal will be down-converted to the IF signal during the receiving state. The SOP integrates two frequency conversion channels and 34 monolithic microwave integrated circuit (MMIC) chips, with final size of 35 mm × 48 mm. In the whole working band, transmitting signal has a power range of 10∼13 dBm with out-of-band spurious suppression below 50 dBc, while the channel under receiving has a gain of 11∼15 dB with automatic gain control (AGC) of 0∼50 dB and 1dB-step. The receiving and transmitting isolation between the two channels are both greater than 40 dB, and the T/R isolation in one channel is better than 40 dB.

中文翻译：

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基于LTCC技术的紧凑型毫米波变频SOP（System on Package）模块

本文提出了一种新型紧凑型毫米波封装系统 (SOP) 模块。为了实现高集成度，模块的14层基板采用低温共烧陶瓷（LTCC）技术制造，该技术在多层集成无源元件方面具有先进性，从而实现了SOP的信号垂直传播。设计的覆盖30∼40 GHz的SOP是毫米波雷达系统的核心模块。当系统进入发射状态时，引入的 SOP 会将输入中频 (IF) 信号与本地信号 (LO) 上混至毫米波频段。接收到的毫米波信号在接收状态下会下变频为中频信号。SOP集成了两个变频通道和34颗单片微波集成电路（MMIC）芯片，最终尺寸为 35 mm × 48 mm。在整个工作频段，发射信号的功率范围为 10～13 dBm，带外杂散抑制低于 50 dBc，而接收信道增益为 11～15 dB，自动增益控制（AGC）为0∼50 dB 和 1dB 步长。两通道收发隔离度均大于40dB，单通道T​​/R隔离度优于40dB。