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Gate-Leakage Current Mechanisms in Silicon Field-Effect Solar Cells
IEEE Journal of Photovoltaics ( IF 2.5 ) Pub Date : 2020-05-18 , DOI: 10.1109/jphotov.2020.2992353
Ling Zhang , Baolin Liu , Chunling Zhang , Wenwu Liu , Xin Li

Field-effect solar cells (FESCs) are increasingly attractive for 2-D heterojunction solar cells and especially for gate-tunable Schottky-junction solar cells. A prerequisite for applying FESCs is that the gate-leakage (GL) power must be far less than the output power. However, the conduction mechanism of the GL current in a FESC has yet to be described clearly, thereby leading to excessive gate power consumption. In this work, the GL current mechanisms for a silicon FESC are extracted and analyzed using temperature-dependent current-voltage measurements under dark and illuminated conditions. It shows that the GL current for a FESC in the dark is dominated by both temperature-dependent Poole-Frenkel (P-F) emission and hopping conduction, whereas, under illumination changes to the temperature-independent space-charge-limited (SCL) current. Furthermore, whether the incident light power of 62.5, 100, or 125 mW/cm2 is used, or the gate dielectric of SiO2 is replaced by HfO2, the dominant GL current mechanism is consistent. Finally, the trap energy level is approximately calculated as 0.38-0.72 eV based on a P-F emission analysis; the mean trap spacing of 0.01-0.18 nm and the activation energy of approximately 0.02 and 0.05 eV are extracted by a hopping conduction analysis. Meanwhile, a rigorous SCL conduction analysis provides a carrier mobility of 1.4 × 10-8 cm2·V-1·s-1 in SiO2 and 5.3 × 10-8 cm2·V-1·s-1 in HfO2.

中文翻译:


硅场效应太阳能电池中的栅极漏电流机制



场效应太阳能电池(FESC)对于二维异质结太阳能电池,尤其是栅极可调肖特基结太阳能电池越来越有吸引力。应用FESC的先决条件是栅极泄漏(GL)功率必须远小于输出功率。然而,FESC中GL电流的传导机制尚未描述清楚,从而导致栅极功耗过高。在这项工作中,使用黑暗和光照条件下与温度相关的电流-电压测量来提取和分析硅 FESC 的 GL 电流机制。它表明,FESC 在黑暗中的 GL 电流主要由温度相关的普尔-弗兰克尔 (PF) 发射和跳跃传导主导,而在光照下,则变化为与温度无关的空间电荷限制 (SCL) 电流。此外,无论是使用 62.5、100 或 125 mW/cm2 的入射光功率,还是用 HfO2 代替 SiO2 栅极电介质,主要的 GL 电流机制都是一致的。最后,根据PF发射分析,陷阱能级大约计算为0.38-0.72 eV;通过跳跃传导分析提取了0.01-0.18 nm的平均陷阱间距和大约0.02和0.05 eV的活化能。同时,严格的SCL传导分析表明,SiO2中的载流子迁移率为1.4 × 10-8 cm2·V-1·s-1,HfO2中的载流子迁移率为5.3 × 10-8 cm2·V-1·s-1。
更新日期:2020-05-18
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