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Analysis of via‐fed cylindrical dielectric resonator antennas
Microwave and Optical Technology Letters ( IF 1.0 ) Pub Date : 2020-06-18 , DOI: 10.1002/mop.32513
Juner M. Vieira 1 , Marcos V. T. Heckler 2
Affiliation  

In this letter, a study of a feeding technique applicable to cylindrical dielectric resonator antennas is presented. The feeding technique analyzed is based on vias glued at the lateral wall of the cylindrical resonator. A series of parametric studies, in terms of the orientation, position and dimensions of the vias, has been carried out to assess the sensitivity to imperfections of the fabrication process on the antenna parameters. In order to validate the computational results, a prototype has been manufactured and measured with a spherical near‐field test facility. The results in terms of S‐parameters and radiation pattern are presented and good agreement between simulations and measurements has been obtained.

中文翻译:

通孔馈电圆柱介质谐振器天线的分析

在这封信中,提出了对适用于圆柱形介质谐振器天线的馈电技术的研究。分析的馈电技术基于胶合在圆柱谐振器侧壁上的通孔。就通孔的方向,位置和尺寸而言,已经进行了一系列参数研究,以评估对天线参数对制造工艺缺陷的敏感性。为了验证计算结果,已制造了原型并使用球形近场测试设备进行了测量。给出了关于S参数和辐射方向图的结果,并且在模拟和测量之间取得了良好的一致性。
更新日期:2020-06-18
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