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An electrical resistance degradation model for thin film under fatigue loading
Fatigue & Fracture of Engineering Materials & Structures ( IF 3.1 ) Pub Date : 2020-06-17 , DOI: 10.1111/ffe.13278
Jiaxing Cheng 1, 2 , Zhaoxia Li 1
Affiliation  

While flexible electronics are ready for the market, keeping their good electric conductivity in long‐term operation is still one of the inevitable challenges. This paper aims to develop a resistance degradation model based on the analysis of the observed fatigue behaviour of thin films and the premature electric failure of thin films. The material deterioration process due to fatigue is represented by the defined fatigue damage variation based on cracks initiation and growth, which establishes a connective relationship with electric resistance degradation. The developed model is validated to compare with experimental results, and numerical results show that it can accurately predict the fatigue life and electrical resistance degradation of thin films of different thicknesses; therefore, it could be a means to assess the electrical performance of thin films on flexible substrates.

中文翻译:

疲劳载荷下薄膜的电阻退化模型

尽管柔性电子产品已准备好投放市场,但在长期运行中保持良好的导电性仍然是不可避免的挑战之一。本文旨在基于对观察到的薄膜疲劳行为和薄膜过早电气故障的分析,开发一种电阻退化模型。由疲劳引起的材料劣化过程由基于裂纹萌生和扩展的定义的疲劳损伤变化表示,这与电阻劣化建立了联系。验证了所开发模型与实验结果的正确性,数值结果表明,该模型可以准确预测不同厚度薄膜的疲劳寿命和电阻退化。因此,
更新日期:2020-06-17
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