当前位置: X-MOL 学术Plasma Processes Polym. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Copper film deposition using a helium dielectric barrier discharge jet
Plasma Processes and Polymers ( IF 2.9 ) Pub Date : 2020-06-15 , DOI: 10.1002/ppap.201900251
Tsung‐Chan Tsai 1 , Katelyn Mcintyre 1 , Matthew Burnette 1 , David Staack 1
Affiliation  

This study demonstrates that plasma‐enhanced chemical vapor deposition of copper films can be achieved in ambient air and at low temperature. A helium dielectric barrier discharge jet with a small mixture of hydrogen and copper(II) acetylacetonate vapor is utilized as the nonthermal plasma source to deposit conductive copper films with low electrical resistivity (<1 × 10−7 Ω·m). The deposited film appears to have three distinct regions (reddish brown, dark blue, and yellowish) from center to edge. Copper nanograins (~50 nm) are observed in both the reddish‐brown and the dark‐blue regions, whereas the yellowish region exhibits a continuous structure containing copper oxide. The copper films are further deposited on various temperature‐sensitive substrates, including plastic, cardboard, agar, and pork skin.

中文翻译:

使用氦电介质阻挡放电喷嘴沉积铜膜

这项研究表明,可以在环境空气和低温下实现等离子体增强的铜膜化学气相沉积。具有少量氢和乙酰丙酮化铜(II)蒸气的氦介电势垒放电射流用作非热等离子体源,以沉积低电阻率(<1×10 -7Ω  ·m)的导电铜膜。沉积的薄膜从中心到边缘似乎具有三个不同的区域(红棕色,深蓝色和淡黄色)。在红棕色和深蓝色区域均观察到铜纳米颗粒(〜50 nm),而微黄色区域显示出包含氧化铜的连续结构。铜膜进一步沉积在各种对温度敏感的基材上,包括塑料,纸板,琼脂和猪肉皮。
更新日期:2020-06-15
down
wechat
bug