During past decades Micro Electro Mechanical Systems (MEMS) have been developed and presented in the market. It is important to find new processes and methods to facilitate MEMS production regarding to growing demand of MEMS devices in IoT, smart and intelligent systems, consumer electronics and medical applications. In this paper, Ni–P layer deposition on insulator substrates is presented. The layer is deposited based on chemical reactions in electroless process. There is a similar method, electroplating, for metal deposition but the substrate must be conductor to transfer electrons and provide essential conditions for electroplating. Electroplating process is not applicable for insulator substrates, while the proposed electroless process can be useful. Different steps, materials, conditions and experimental results for Ni–P electroless are presented. A fabrication process for DC contact RF MEMS switch based on Ni–P electroless is introduced, too. As one advantage of this process, Ni and Ni–P are ferromagnetic material and any suspended structure can be actuated by magnetic fields. It will be beneficial when applying other actuation mechanisms like electrostatic, thermal or piezoelectric are difficult or impossible to be applied.

在过去的几十年中，已经开发出微机电系统（MEMS）并将其投放市场。对于物联网，智能和智能系统，消费电子产品和医疗应用中不断增长的MEMS设备需求，找到促进MEMS生产的新工艺和方法很重要。在本文中，介绍了在绝缘体衬底上沉积的Ni-P层。该层是基于化学过程中的化学反应而沉积的。有一种类似的电镀方法，用于金属沉积，但是基板必须是导体才能转移电子并提供电镀的基本条件。电镀工艺不适用于绝缘体基板，而建议的化学工艺可能有用。不同的步骤，材料，介绍了Ni-P化学镀的条件和实验结果。还介绍了基于Ni-P化学镀的DC接触RF MEMS开关的制造工艺。作为该过程的一个优势，Ni和Ni-P是铁磁材料，任何悬浮结构均可通过磁场驱动。当难以或不可能应用诸如静电，热或压电的其他致动机制时，这将是有益的。