Abstract Using wetting balance method, the wettability of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders (Sn-0.7Cu, Sn-0.3Ag-0.7Cu, and eutectic SnPb (E-SnPb, Sn63Pb37)) was evaluated at 290–310 °C. Among these solders, Sn shows the best wettability with amorphous alloy because of the strongest interfacial reactivity for oxide film removal, and E-SnPb shows the best wettability with crystalline alloy due to the minimum surface tension of E-SnPb solder. Generally, amorphous alloys have the better wettability. At least two factors caused this situation, i.e., the relatively larger surface energy of amorphous alloy and the volume shrinkage caused by the structural relaxation and the primary crystallization during wetting. In this study, the wetting mechanism actually is the deoxideation, which includes the reaction of Sn with NiO, and the mechanical removal of the oxide film.

中文翻译：

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锡和锡基焊料润湿镍基非晶合金和结晶合金

摘要 使用润湿平衡法，评估了 Sn 和 Sn 基焊料（Sn-0.7Cu、Sn-0.3Ag-0.7Cu 和共晶 SnPb（E-SnPb、Sn63Pb37））对 Ni 基非晶和结晶合金的润湿性在 290–310 °C。在这些焊料中，Sn 与非晶合金的润湿性最好，因为去除氧化膜的界面反应最强，E-SnPb 与结晶合金的润湿性最好，因为 E-SnPb 焊料的表面张力最小。一般来说，非晶合金具有更好的润湿性。造成这种情况的原因至少有两个，即非晶合​​金相对较大的表面能和润湿过程中结构松弛和初生结晶引起的体积收缩。在这项研究中，润湿机制实际上是脱氧，