Flexible and electrically conductive composites based on 3D hierarchical silver dendrites.,Soft Matter

当前位置： X-MOL 学术 › Soft Matter › 论文详情

Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)

Flexible and electrically conductive composites based on 3D hierarchical silver dendrites.
Soft Matter ( IF 2.9 ) Pub Date : 2020-06-09 , DOI: 10.1039/d0sm00908c
Bo Song ₁ , Xueqiao Wang ₁ , Shiv Patel ₁ , Fan Wu ₁ , Kyoung-Sik Moon ₁ , Ching-Ping Wong ₁

Affiliation

Conductive polymer composites have gained increasing popularity as essential components for next-generation flexible electronics. Chemical tuning of the polymer matrix and shape engineering of conductive fillers are two promising routes for material development to improve the electromechanical characteristics. Here we describe highly conductive and flexible polyurethane (PU)-based composites using 3D hierarchical silver dendrite (SD) micro/nanostructures as conductive fillers. The highly crystalline SDs adopt a 6-fold symmetry with high aspect ratio branches, which can be interlocked to provide better electrical contact under strain and sintered at low temperature to reduce contact resistance. By selecting the appropriate chemistry, SD fillers lubricated with surfactants can be well dispersed into PU resin and the surfactants can be in situ removed during the curing process due to the presence of polyols in the formulation. The unique SD structures and modified polymer–filler interface are key elements in realizing excellent electrical and mechanical properties. Specifically, the SD–PU composites demonstrated an ultralow resistivity of 7.6 × 10⁻⁵ Ω cm, a low percolation threshold of 3 vol%, minimal resistance change under mechanical strains, and strong adhesion to substrates. The evolution of temperature-dependent resistivity has been correlated with polymer dynamics and sintering behavior to understand the conduction mechanism.

中文翻译：

基于3D分层银树枝状晶体的柔性导电复合材料。

导电聚合物复合材料作为下一代柔性电子产品的基本组件已越来越受欢迎。聚合物基体的化学调节和导电填料的形状工程是材料开发以改善机电特性的两条有希望的途径。在这里，我们描述了使用3D分层银枝晶（SD）微/纳米结构作为导电填料的高导电性和柔性聚氨酯（PU）基复合材料。高度结晶的SD采用具有高长宽比分支的6倍对称性，可以互锁以在应变下提供更好的电接触，并在低温下烧结以降低接触电阻。通过选择适当的化学方法，可以将用表面活性剂润滑的SD填料很好地分散在PU树脂中，并且可以将表面活性剂由于配方中存在多元醇，因此在固化过程中就地去除了原位。独特的SD结构和改良的聚合物-填料界面是实现出色的电气和机械性能的关键要素。具体而言，SD-PU复合材料表现出7.6×10超低电阻^-5 Ω厘米，3体积％的低逾渗阈值，下机械应变最小的阻力变化，并且强对基材的粘附。温度依赖性电阻率的演变已与聚合物动力学和烧结行为相关联，以了解导电机理。

更新日期：2020-07-29

点击分享查看原文

点击收藏

阅读更多本刊最新论文本刊介绍/投稿指南11