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Mechanics and deformation of shape memory polymer kirigami microstructures
Extreme Mechanics Letters ( IF 4.3 ) Pub Date : 2020-06-10 , DOI: 10.1016/j.eml.2020.100831
Kian Bashandeh , Jungkyu Lee , Qian Wu , Yi Li , Xueju Wang , Yan Shi , Xiaogang Guo , Yonggang Huang , John A. Rogers , Andreas A. Polycarpou

The assembly of three dimensional (3D) structures through compressive buckling of 2D precursors can serve as a promising and robust tool to realize different classes of advanced materials in a broad range of applications with complex geometries and a span of length scales from sub-micron to macro scales. In this study, a shape memory polymer (SMP) material was used as the precursor to form different configurations of 3D kirigami microstructures. 3D SMP structures can serve in a wide range of applications, such as biomedical and aerospace, which require a level of robustness and compliance. To this end, the mechanical response of assembled 3D buckled kirigami structures were investigated through mechanical cyclic and single loading compression at room and elevated temperatures, respectively. The experiments at room temperature were performed to examine the mechanical resilience and stability of the structures upon repeated loading. The load bearing capacity, resiliency, and stability under deformation were shown to be largely affected by their structural shape. In-situ scanning electron microscopy experiments at elevated temperatures demonstrated the outstanding shape memory behavior by full recovery to their original shape, without any structural damage or fracture. Computational modeling supports the experimental findings and contributes to the understanding of deformation and fracture of the structures.



中文翻译:

形状记忆聚合物折纸微结构的力学和变形

通过2D前体的压缩屈曲而组装的三维(3D)结构可作为一种有前途且强大的工具,用于在具有复杂几何形状以及从微米到微米的长度范围的广泛应用中实现不同类别的先进材料。宏观尺度。在这项研究中,形状记忆聚合物(SMP)材料被用作前体,以形成3D千纸鹤微结构的不同配置。3D SMP结构可用于需要坚固性和顺应性的各种应用,例如生物医学和航空航天。为此,分别通过在室温和高温下的机械循环压缩和单次加载压缩来研究组装的3D弯曲的折纸结构的机械响应。在室温下进行实验以检查结构在重复加载后的机械弹性和稳定性。结果表明,其承载能力,弹性和变形稳定性在很大程度上受其结构形状的影响。高温下的原位扫描电子显微镜实验通过完全恢复到其原始形状而没有任何结构损坏或断裂,证明了出色的形状记忆性能。计算模型支持实验结果,并有助于理解结构的变形和断裂。高温下的原位扫描电子显微镜实验通过完全恢复到其原始形状而没有任何结构损坏或断裂,证明了出色的形状记忆性能。计算模型支持实验结果,并有助于理解结构的变形和断裂。高温下的原位扫描电子显微镜实验通过完全恢复到其原始形状而没有任何结构损坏或断裂,证明了出色的形状记忆性能。计算模型支持实验结果,并有助于理解结构的变形和断裂。

更新日期:2020-06-10
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