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Surface State Variation during Scanning in a Low-Voltage SEM and Its Effect on of Relief Structure Sizes
Physics of the Solid State ( IF 0.9 ) Pub Date : 2020-06-10 , DOI: 10.1134/s106378342006013x Yu. V. Larionov , Yu. V. Ozerin
中文翻译:
低压SEM扫描过程中的表面状态变化及其对凸版结构尺寸的影响
更新日期:2020-06-10
Physics of the Solid State ( IF 0.9 ) Pub Date : 2020-06-10 , DOI: 10.1134/s106378342006013x Yu. V. Larionov , Yu. V. Ozerin
Abstract
The variation of low-energy slow secondary electron emission from the surface of relief structures (bumps) during their prolonged scanning in a low-voltage scanning electron microscope is estimated. The variation nature depends on the bump region profile, which is especially complex near relief structure angles. As a result, corresponding curve portions of the bump video signal, which results in an increase or even a decrease in geometrical sizes of these portions. The emission variation is explained by local charge induction in the natural oxide layer on the silicon surface. The portion size also changes due to contamination film bump deposition on the surface. Presumably, its deposition depends on charges induced on the bump surface and, hence, is poorly reproducible. The case of the absence of contamination broadening of a bump due to its prolonged scanning is fixed.中文翻译:
低压SEM扫描过程中的表面状态变化及其对凸版结构尺寸的影响