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Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process
Polymer Testing ( IF 5.1 ) Pub Date : 2020-10-01 , DOI: 10.1016/j.polymertesting.2020.106669
Jung-Hwan Lee , Maneesh Kumar Poddar , Kwang-Min Han , Heon-Yul Ryu , Nagendra Prasad Yerriboina , Tae-Gon Kim , Yutaka Wada , Satomi Hamada , Hirokuni Hiyama , Jin-Goo Park

Abstract In post-CMP (chemical mechanical polishing) processing, the use of poly vinyl acetal (PVA) brushes to clean the wafer surface is one of the most effective and prominent techniques applied for the removal of CMP contaminants. Recently, organic contaminants induced in different types of PVA brushes during brush manufacturing have been drawing substantial research interest in CMP communities. In this study, investigated the root cause of these residual organic impurities in two different types of PVA brushes was investigated: roller and pencil type brushes. PVA roller brushes have a skin layer due to the brush molding process, but pencil-type PVA brushes do not have the skin layer. Extraction of organic impurities from both types of brushes was accomplished using an ultrasound-assisted technique at a sonication frequency of 40 kHz, and input power of 600 W. Further evaluation of these organic impurities using Field Emission Scanning Electron Microscopy (FE-SEM) revealed a large number of organic impurities in roller brushes and negligible impurities in pencil brushes. Time of flight secondary ion mass spectrometry (TOF-SIMS) analysis confirmed polydimethylsiloxane (PDMS) as the organic impurities extracted from PVA roller brushes, which were generated during the brush manufacturing process. The PDMS content in PVA roller brushes was further analyzed using FE-SEM micrographs via dissolving the organic impurities in tetramethylammonium hydroxide solution (TMAH). During brush fabrication, the high content of PDMS organic impurities in roller PVA brushes is essentially attributed to the presence of the additional skin layer formed by the mold releasing agent at the mold-cavity interface.

中文翻译:

CMP 后清洗过程中滚筒和铅笔型 PVA 刷的有机污染源的比较评估

摘要 在 CMP(化学机械抛光)后处理中,使用聚乙烯乙缩醛 (PVA) 刷清洁晶片表面是用于去除 CMP 污染物的最有效和最突出的技术之一。最近,在刷子制造过程中在不同类型的 PVA 刷子中引起的有机污染物引起了 CMP 社区的大量研究兴趣。在这项研究中,调查了两种不同类型的 PVA 刷子中这些残留有机杂质的根本原因:滚筒和铅笔型刷子。由于毛刷成型工艺,PVA滚刷有表层,而铅笔型PVA刷没有表层。使用超声辅助技术以 40 kHz 的超声频率从两种类型的刷子中提取有机杂质,和 600 W 的输入功率。使用场发射扫描电子显微镜 (FE-SEM) 对这些有机杂质的进一步评估显示,滚刷中存在大量有机杂质,而铅笔刷中的杂质可忽略不计。飞行时间二次离子质谱 (TOF-SIMS) 分析证实聚二甲基硅氧烷 (PDMS) 是从 PVA 滚刷中提取的有机杂质,这些杂质是在刷子制造过程中产生的。通过将有机杂质溶解在四甲基氢氧化铵溶液 (TMAH) 中,使用 FE-SEM 显微照片进一步分析了 PVA 滚刷中的 PDMS 含量。在刷子制作过程中,
更新日期:2020-10-01
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