Abstract

Studies on the development of modern methods of precision surface polishing for the production of electronic device and optical system elements from glass and optical and semiconductor crystals are reviewed. The mechanisms that underlie material removal from the workpiece surface are described for polishing with a tool with bound abrasive, mechanical polishing with polishing powder suspensions, and chemicomechanical polishing. The results of the study of the mechanism that underlies the formation of the optical surface nanoprofile during polishing are presented and the relevance of studying the regularities of ultrasmooth surface formation during chemicomechanical polishing is emphasized.

中文翻译：

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由玻璃，Sitall以及光学和半导体晶体制成的光电设备元件的精密表面抛光：回顾

摘要

综述了现代精密表面抛光方法的发展研究，该方法用于从玻璃，光学和半导体晶体生产电子设备和光学系统元件。描述了从工件表面去除材料的基础机理，这些方法包括使用带有磨料的工具进行抛光，使用抛光粉悬浮液进行机械抛光以及化学机械抛光。提出了在抛光过程中形成光学表面纳米轮廓的机理的研究结果，并强调了研究化学机械抛光过程中超光滑表面形成规律的相关性。