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Ultraprecision laser-assisted diamond machining of single crystal Ge
Precision Engineering ( IF 3.5 ) Pub Date : 2020-06-08 , DOI: 10.1016/j.precisioneng.2020.04.020
Hossein Shahinian , Kang Di , Jayesh Navare , Charan Bodlapati , Dmytro Zaytsev , Deepak Ravindra

In this paper we present an experimental study on ultraprecision machining (UPM) of single crystal Ge using the μ-LAM process. The material is oriented with the cutting plane normal to the <111> direction. It is shown that increased hydrostatic pressures on the surface during cutting by increasing the tool radius and negative rake angle can aid in enhancing ductile material removal from the surface. It is shown that the cutting performance can be increased by approximately 400% using the optimal tool geometry. It is also shown that the optimal tooling geometry with a steep negative rake angle, i.e. −65°, is capable of producing repeatable surface form and finish over long cutting distances. Finally, it will be shown that the laser beam used for μ-LAM, with the right amount of power, produces surfaces that are under less post machining residual stresses.



中文翻译:

单晶锗的超精密激光辅助金刚石加工

在本文中,我们提供了使用μ-LAM工艺对单晶Ge进行超精密加工(UPM)的实验研究。材料的切割平面垂直于<111>方向。结果表明,在切削过程中,通过增加刀具半径和负前角来增加表面静水压力,有助于增强韧性材料从表面的去除。结果表明,使用最佳刀具几何形状可以将切削性能提高约400%。还显示出,具有陡峭的负前角(即-65°)的最佳刀具几何形状能够产生可重复的表面形状,并能在较长的切削距离上进行精加工。最后,将显示用于μ-LAM的激光束具有正确的功率量,

更新日期:2020-06-08
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