Abstract Lead-free nanocomposite solder pastes were prepared with Sn-3Ag-0.5Cu (SAC 305) microsolders, 1–5 wt% Sn nanoparticles, and a flux. The nanocomposite pastes were studied using differential scanning calorimetry (DSC) to understand their thermal properties and the interactions between the different sized powders. DSC measurements showed two distinct endothermic peaks in all nanocomposite pastes with Sn nanoparticle additions, with one peak attributing to the melting of SAC micropowders and another peak to the melting of Sn nanoparticles. With the increased amount of Sn nanoparticle additions, the SAC material showed little change in its melting temperatures due to its large mass fraction. Multi-cycle DSC measurements of the nanocomposite solder pastes showed additional endothermic peaks, suggesting that the SAC 305 microsolder powders and pure Sn nanoparticles may have interacted with each other to form additional alloys. Changes in enthalpy of melting from DSC measurements were also used to analyze the melting characteristics of the nanocomposite pastes. Additionally, thermogravimetric analysis (TGA) showed that more weight was retained for the nanocomposite solder pastes with increasing Sn nanoparticle additions, compared to the baseline SAC solder paste.

中文翻译：

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添加Sn纳米颗粒对Sn-Ag-Cu无铅焊膏热性能的影响

摘要 使用 Sn-3Ag-0.5Cu (SAC 305) 微焊料、1-5 wt% Sn 纳米颗粒和助焊剂制备无铅纳米复合焊膏。使用差示扫描量热法 (DSC) 研究纳米复合糊料，以了解它们的热性能和不同尺寸粉末之间的相互作用。DSC 测量显示，在所有添加了 Sn 纳米颗粒的纳米复合糊料中，都有两个不同的吸热峰，一个峰归因于 SAC 微粉的熔化，另一个峰归因于 Sn 纳米颗粒的熔化。随着 Sn 纳米颗粒添加量的增加，SAC 材料由于其质量分数大，其熔化温度几乎没有变化。纳米复合焊膏的多循环 DSC 测量显示出额外的吸热峰，这表明 SAC 305 微焊料粉末和纯 Sn 纳米颗粒可能相互相互作用以形成额外的合金。来自 DSC 测量的熔化焓的变化也用于分析纳米复合糊料的熔化特性。此外，热重分析 (TGA) 表明，与基线 SAC 焊膏相比，随着 Sn 纳米颗粒添加量的增加，纳米复合焊膏保留了更多的重量。