Abstract An analytical formulation to evaluate the contact pressure evolution in interference fit joints working under high temperature regime, is proposed. The phenomenon is mainly due to the stress relaxation related to the creep behaviour of materials used to realize this kind of joints. Despite extensive researches on the topic, the decay of contact pressure due to creep relaxation is commonly not considered or evaluated only by numerical methods. The proposed analytic solution correlates the contact pressure to the creep material properties and could be largely used to improve the design or the fitness-for-service assessment of joints that transmit load thanks to the interference fit. The formulation assumes the plane strain condition for the inner element and the plane stress condition for the outer one. It was validated by finite element analysis (FEA) and gives accurate prediction of the contact pressure evolution both in plane and axisymmetric simulations.

中文翻译：

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蠕变状态下干涉接头接触压力演化的解析公式

摘要 提出了一种评估高温状态下过盈配合接头接触压力演变的分析公式。这种现象主要是由于与用于实现此类接头的材料的蠕变行为相关的应力松弛。尽管对该主题进行了广泛的研究，但通常仅通过数值方法不考虑或评估由于蠕变松弛引起的接触压力衰减。所提出的分析解决方案将接触压力与蠕变材料特性相关联，并且可以在很大程度上用于改进设计或对由于过盈配合传递载荷的接头的适用性评估。该公式假定内部单元的平面应变条件和外部单元的平面应力条件。