Substrates with high thermal conductivity (TC), outstanding mechanical strength, and low coefficient of thermal expansion (CTE) and dielectric constant are ideal materials for electronic packaging. The preparation of ceramic/polymer composites is a feasible method to meet the above requirements. Herein, a kind of reticulated porous alumina ceramics (RPCs) was introduced into epoxy resin (EP) doped with tetrapod-like zinc oxide whiskers (T-ZnOw) to produce EP/Al₂O₃/T-ZnOw composites with continuous interpenetrating network structure. The addition of 11.7 vol% RPCs and 6 vol% T-ZnOw caused an increase of TC to 1.968 W·m⁻¹·K⁻¹. Compared to pure EP, the CTE of EP/11.7 vol% Al₂O₃/6 vol% T-ZnOw composite was reduced by an order of magnitude and the flexural modulus increased 5.7 times. The novel substrate materials, fabricated via the polymer replica and vacuum impregnation methods, featured attractive properties for potential use in electronic packaging applications with low fillers loading.

具有高导热率（TC），出色的机械强度以及低热膨胀系数（CTE）和介电常数的基板是电子封装的理想材料。陶瓷/聚合物复合材料的制备是满足上述要求的可行方法。在此，将一种网状多孔氧化铝陶瓷（RPC）引入掺有四足状氧化锌晶须（T-ZnOw）的环氧树脂（EP）中，以制备具有连续互穿网络的EP / Al ₂ O ₃ / T-ZnOw复合材料结构体。添加11.7体积％的RPC和6体积％的T-ZnOw导致TC增加至1.968W·m ^-1 ·K ^-1。与纯EP相比，EP / 11.7 vol％Al ₂ O ₃的CTE/ 6体积％的T-ZnOw复合材料减少了一个数量级，弯曲模量增加了5.7倍。通过聚合物复制品和真空浸渍方法制造的新型基材材料具有诱人的性能，可潜在地用于低填料填充量的电子包装应用。