With the rising market for inertial MEMS, reliable stiction detection methods at wafer level become increasingly important. This paper describes a new mechanism for producing enhanced stiction results at wafer level testing due to electric stimulation of the electrode fingers of the MEMS devices and provides a new wafer level measurement method to detect critical frequency ranges. Dependent on the architecture of the sensor core the modulation frequency and amplitude have a distinct impact on the stiction results. The effect is studied systematically for two different test device types by variation of the modulation carrier amplitude and frequency. The results are compared to critical modes gained from transient finite element simulations of the sensor cores. Additionally, a mechanical modal analysis has been performed for result verification. The obtained results show a distinct correlation between the resonance frequencies of the electrode fingers and the likelihood of stiction events. [2019-0189]

中文翻译：

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MEMS 加速度计的频率感应静摩擦

随着惯性 MEMS 市场的不断增长，晶圆级的可靠静摩擦检测方法变得越来越重要。本文描述了一种新机制，用于在晶圆级测试中由于 MEMS 器件的电极指的电刺激而产生增强的静摩擦结果，并提供了一种新的晶圆级测量方法来检测临界频率范围。取决于传感器核心的架构，调制频率和幅度对静摩擦结果有明显影响。通过改变调制载波幅度和频率，系统地研究了两种不同测试设备类型的影响。结果与从传感器核心的瞬态有限元仿真中获得的临界模式进行了比较。此外，还进行了机械模态分析以进行结果验证。获得的结果表明电极指的共振频率与静摩擦事件的可能性之间存在明显的相关性。[2019-0189]