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An Alternative Approach to Investigate V-Shaped Electrothermal Microactuators in Vacuum
Journal of Microelectromechanical Systems ( IF 2.7 ) Pub Date : 2020-06-01 , DOI: 10.1109/jmems.2019.2959717
Gabriel R. de S. Gama , Claudia A. A. Coelho , Joao Gaspar , Paulo J. P. Freitas , Rubem L. Sommer , Alexandre Mello

In this work, we use a simplified version of Young’s solution for the steady-state Joule-heating, that uses temperature dependent thermal and electrical conductivities, to find the temperature and displacement behavior of a V-shaped electrothermal microactuator (ETMA) device. In order to test and validate our approach we performed FEM simulations and actually built an ETMA device by microfabrication. The experimental device displacement was measured in vacuum, with a scanning electron microscope. Our numerical results agree quite well with the FEM simulation and experimental results up to a displacement of (0.8 ± 0.2) $\mu \text{m}$ and applied current of 30 mA. Above 35 mA, an abrupt variation of the resistivity is observed followed by surface degradation at 50 mA and device melting at 52 mA. The validity of our approach is discussed of the device geometry and material parameters. [2019-0208]

中文翻译:

在真空中研究 V 形电热微致动器的另一种方法

在这项工作中,我们使用了稳态焦耳加热的杨氏解的简化版本,该解使用温度相关的热导率和电导率,以找到 V 形电热微致动器 (ETMA) 装置的温度和位移行为。为了测试和验证我们的方法,我们进行了 FEM 模拟并通过微加工实际构建了一个 ETMA 设备。实验装置位移在真空中用扫描电子显微镜测量。我们的数值结果与有限元模拟和实验结果非常吻合,位移为 (0.8 ± 0.2) $\mu \text{m}$ 和施加的电流为 30 mA。高于 35 mA,观察到电阻率突然变化,随后在 50 mA 时表面退化,在 52 mA 时器件熔化。我们的方法的有效性讨论了器件几何形状和材料参数。[2019-0208]
更新日期:2020-06-01
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