Abstract Cu@Ag nanoparticles were synthesized to act as a doping conductive filler for micron-sized Ag plates as conductive adhesive. Because of the defect for conductive channels of Ag plates-based conductive adhesive, it is highly desirable to remove the defect to improve the conductivity. The synthesized Cu@Ag nanoparticles, prepared via a wet-chemical method, were found to enhance the conductivity and tensile strength of a Ag plates-based conductive adhesive. The volume resistivity of a Cu@Ag nanoparticle doped Ag plate-based conductive adhesive can be reduced to 2.0 × 10−6 Ω m, and the tensile strength of the conductive adhesive can reach 16 MPa, revealing their great potential for practical application.

中文翻译：

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Cu@Ag纳米颗粒掺杂微米级银板，用于增强导电性的导电粘合剂

摘要 Cu@Ag 纳米颗粒被合成作为掺杂导电填料用于微米尺寸的银板作为导电粘合剂。由于银板基导电胶的导电通道存在缺陷，因此非常需要去除该缺陷以提高导电性。发现通过湿化学方法制备的合成的 Cu@Ag 纳米粒子可以提高基于银板的导电粘合剂的导电性和拉伸强度。Cu@Ag纳米粒子掺杂的银板基导电胶的体积电阻率可以降低到2.0×10-6 Ω·m，导电胶的拉伸强度可以达到16 MPa，显示出其巨大的实际应用潜力。