With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.

中文翻译：

---

新型金基焊料合金：电气包装问题的潜在答案

随着电子技术的发展和第五代蜂窝网络的建设，具有更高集成度和功率的电子设备得到了广泛的应用。因此，对电子包装材料提出了更高的要求。在过去的几十年中，高铅焊料合金被广泛用于低温和中温焊接，但是由于毒性而被禁止使用。具有适当熔化和机械性能的金基焊料合金显示出替代高铅焊料合金的巨大潜力，并且最近受到重视。但是，与含铅焊料合金相比，对新型金基焊料合金的研究还远远不够，其性能和可靠性尚不清楚。在本文中，综述了近年来有关低温和中温金基钎料的研究现状，介绍了它们的组织，力学性能和可靠性。此外，讨论并比较了金基钎料合金的新型加工技术。