Wire Electrochemical Micromachining (Wire ECMM) process has become a topical field of research in today's context of micromachining. This is due to the agility which the process offers, that makes it as one of the most suitable option for machining of micro parts and features. Process capabilities of the Wire ECMM such as protracted tool life, surface integrity, material removal rate, surface finish, burr and heat affected zone-free surface gives it an edge over Wire Electric Discharge Machining (WEDM), its counterpart in thermal based machining process. However, the control of process parameters in Wire ECMM is not easy and requires knowledge of their influence. At present, Wire ECMM is still a lab-based technique. This article aims to provide a detailed and well-arranged literature survey of the advancements made in Wire ECMM to date along with an insightful discussion on the science of electrochemical dissolution. Key factors influencing the process performance are identified and reviewed. Different analytical and numerical models proposed in the process are also reviewed critically. This article is expected to assist the researchers/practicing engineers in identifying the existing research gaps and contributing towards making Wire ECMM an industrially viable option for micromachining.

在当今的微加工环境中，线电化学微加工（Wire ECMM）工艺已成为研究的主题。这是由于该过程提供的敏捷性，使其成为加工微型零件和特征的最合适的选择之一。Wire ECMM的加工能力，例如延长的刀具寿命，表面完整性，材料去除率，表面光洁度，毛刺和无热影响的无区域表面，使它比Wire Electric Discharge Machining（WEDM）（在基于热的加工工艺中相对应）具有优势。但是，在Wire ECMM中控制过程参数并不容易，并且需要了解其影响。目前，Wire ECMM仍然是基于实验室的技术。本文旨在提供对Wire ECMM迄今为止取得的进展的详细且安排合理的文献调查，并对电化学溶解科学进行深入的讨论。确定并审查了影响过程性能的关键因素。还对过程中提出的不同分析模型和数值模型进行了严格审查。本文有望帮助研究人员/实践工程师确定现有的研究差距，并为使Wire ECMM成为微加工的工业可行选择做出贡献。