Abstract

The approaches used to the form electrically conductive structures on aluminum and anodized aluminum substrates using such photoresists as synthesized triacrylamide polyfluorochalcone (TAFCh) and commercial SU-8 are investigated. The effect of adding HF to anodizing and copper-plating electrolytes on the formation of the microstructure of conductive copper films is studied. The experiments reveal that preliminary electrochemical polishing of aluminum substrates makes it possible to significantly increase the quality of copper’s electrochemical deposition in microstructures. The resulting conductive tracks have a resolution of up to 10 μm when they are obtained on an anodized aluminum surface using TAFCh photoresist. In the case of using SU-8 photoresist on anodic alumina, we failed to obtain metallized structures with a resolution higher than 40 μm.

中文翻译：

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使用多氟查耳酮作为光致抗蚀剂层，通过将铜电化学沉积到阳极氧化铝基板上来获得导电结构

摘要

研究了使用光致抗蚀剂（如合成的三丙烯酰胺多氟查尔酮（TAFCh）和商用SU-8）在铝和阳极氧化铝基板上形成导电结构的方法。研究了在阳极氧化和镀铜电解液中添加HF对导电铜膜微结构形成的影响。实验表明，铝基板的初步电化学抛光可以显着提高微观结构中铜的电化学沉积质量。当使用TAFCh光致抗蚀剂在阳极氧化铝表面上获得所得的导电迹线时，其分辨率最高可达10μm。如果在阳极氧化铝上使用SU-8光刻胶，