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Thermoelectric Cooling of Heat-Loaded Electronics
Russian Microelectronics Pub Date : 2020-03-25 , DOI: 10.1134/s1063739720020092 E. N. Vasil’ev
中文翻译:
热负载电子的热电冷却
更新日期:2020-03-25
Russian Microelectronics Pub Date : 2020-03-25 , DOI: 10.1134/s1063739720020092 E. N. Vasil’ev
Abstract
The characteristics of cooling and thermal control systems are calculated depending on the parameters of the thermoelectric module and the heat-loaded element. The values of the temperature difference in the heat distributor for a thermoelectric module with dimensions 30 × 30 mm2 and 40 × 40 mm2 are determined. The significant effect of the inhomogeneity of the heat flux and the temperature field of the surface of the thermoelectric module on the value of the temperature difference in the heat distributor is established. The cooling efficiency and power consumption for different cooling capacities are compared taking into account the influence of the thermal resistance of the heat-removal system. The parameters and factors affecting the choice of thermoelectric module and cooling modes are analyzed.中文翻译:
热负载电子的热电冷却