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Thermoelectric Cooling of Heat-Loaded Electronics
Russian Microelectronics Pub Date : 2020-03-25 , DOI: 10.1134/s1063739720020092
E. N. Vasil’ev

Abstract

The characteristics of cooling and thermal control systems are calculated depending on the parameters of the thermoelectric module and the heat-loaded element. The values of the temperature difference in the heat distributor for a thermoelectric module with dimensions 30 × 30 mm2 and 40 × 40 mm2 are determined. The significant effect of the inhomogeneity of the heat flux and the temperature field of the surface of the thermoelectric module on the value of the temperature difference in the heat distributor is established. The cooling efficiency and power consumption for different cooling capacities are compared taking into account the influence of the thermal resistance of the heat-removal system. The parameters and factors affecting the choice of thermoelectric module and cooling modes are analyzed.


中文翻译:

热负载电子的热电冷却

摘要

根据热电模块和热负载元件的参数计算冷却和热控制系统的特性。尺寸为30×30 mm 2和40×40 mm 2的热电模块的热量分配器中的温度差值确定。建立了热通量和热电模块表面温度场的不均匀性对热分布器中的温差值的显着影响。考虑到排热系统的热阻的影响,比较了不同冷却能力的冷却效率和功耗。分析了影响热电模块选择和冷却方式的参数和因素。
更新日期:2020-03-25
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