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Microstructure and Electrical Property of Ex-Situ and In-Situ Copper Titanium Carbide Nanocomposites
Metals ( IF 2.9 ) Pub Date : 2020-06-02 , DOI: 10.3390/met10060735
Nguyen Hoang Viet , Nguyen Thi Hoang Oanh

In this study, ex-situ Cu-TiC nanocomposites of 1, 3 and 5 vol. % TiC and in-situ Cu-TiH2-C nanocomposites (corresponding to 5 vol. % TiC) were prepared using ball milling and spark plasma sintering methods. Powder mixtures were milled for 4 h at 400 rpm. As-milled Cu-TiC composite powders were consolidated under an applied pressure of 70 MPa. The phase composition, and microstructure of the composite samples were characterized by X-ray diffraction, and scanning electron microscope and transmission electron microscope techniques, respectively. With the increasing TiC content from 1 to 5 vol. %, the hardness of the ex-situ composites when sintered at 600 °C changed between 161.4 and 178.5 HV and the electrical conductivity decreased from 52.1 to 47.6 % IACS. In-situ Cu-TiH2-C nanocomposite sintered at 950 °C had higher hardness and electrical conductivity than ex-situ Cu-TiC composite due to having a homogenous distribution of nano reinforcement particles and dense structure.

中文翻译:

异位和原位铜碳化钛纳米复合材料的微观结构和电性能

在这项研究中,1、3和5卷的易位Cu-TiC纳米复合材料。使用球磨和火花等离子体烧结方法制备%TiC和原位Cu-TiH 2 -C纳米复合材料(对应于5体积%TiC)。将粉末混合物在400 rpm下研磨4小时。研磨后的Cu-TiC复合粉末在70 MPa的施加压力下固结。通过X射线衍射,扫描电子显微镜和透射电子显微镜技术分别表征了复合样品的相组成和微观结构。随着TiC含量从1到5 vol。%,在600℃下烧结时,非复合材料的硬度在161.4和178.5HV之间变化,电导率从52.1%降低到47.6%IACS。
更新日期:2020-06-02
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