Although the thermo-viscoelastic properties of solids have been reported in many articles, no effort has been made to investigate the coupled thermo-viscoelastic and plasma wave behavior of semiconductors based on the photothermal theory. In this work, a new mathematical model of heat and plasma transport has been constructed for semiconductor of viscoelastic material. Some fundamental theorems on the linear coupled and generalized theories can be easily obtained as special cases. A two-dimensional problem is viewed for a half-space of an organic semiconductor plate whose surface is traction free and subjected to an arbitrary time-dependent heat flux. Laplace and Fourier integral transforms are utilized. The carrier density, temperature, thermal stress, and displacement distributions have been obtained through the use of the theoretical model together with plasma and thermo-viscoelastic effects. The inversion technique for Fourier and Laplace transforms is carried out using a numerical technique based on Fourier series expansions. Comparisons are made with the results anticipated through the coupled idea and generalized theory. The influence of the some parameters on all the regarded fields is examined for different theories.

尽管在许多文章中已经报道了固体的热粘弹性特性，但尚未基于光热理论研究半导体的耦合热粘弹性和等离子体波行为。在这项工作中，为粘弹性材料的半导体构建了一个新的热和等离子体传输数学模型。线性耦合和广义理论的一些基本定理可以很容易地作为特例获得。针对有机半导体板的半空间观察二维问题，该有机半导体板的表面不受牵引并受到任意时间相关的热通量。使用拉普拉斯和傅里叶积分变换。载流子密度、温度、热应力、通过使用理论模型以及等离子体和热粘弹性效应，获得了位移分布。傅里叶和拉普拉斯变换的反演技术是使用基于傅里叶级数展开的数值技术进行的。通过耦合思想和广义理论预测的结果进行了比较。针对不同的理论检验了一些参数对所有相关领域的影响。