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Synchronously improved reliability, figure of merit and adhesion of flexible copper nanowire networks by chitosan transition
Nanotechnology ( IF 2.9 ) Pub Date : 2020-06-30 , DOI: 10.1088/1361-6528/ab967b
Yongtao Sun 1 , Chaoping Du , Muying Wu , Le Zhao , Shihui Yu , Baoming Gong , Qian Ding
Affiliation  

Copper nanowires (CuNWs) are remarkable components that can replace indium tin oxide (ITO) as transparent electrodes due to their low cost, high conductivity and acceptable transmittance. However, a common coating method can cause poor electrical, optical and adhesively properties because of the creation of loosely connected junctions. In addition, the dissatisfactory thermal and environmental stabilities also limit the practical applications. These problems should be overcome in CuNW-based films for reliable transparent electrodes through material and engineering approaches. In this work, a novel transparent composite electrode composed of chitosan and CuNWs on flexible polyethylene terephthalate (PET) substrate, with synchronously strengthened adhesion, heightened transmittance, reduced resistivity, improved flexibility, enhanced thermal stability and increased environmental stability, is prepared without vacuum processing and high-temperature annealing. The effects of the number of CuNW network layers and chitosan concentration on the performance of chitosan/CuNWs composite transparent electrodes were studied. The resulting electrodes exhibit an excellent conductivity (sheet resistance: 15.6 Ω/sq.) and a superior optical transmittance (~87%) at 550 nm. Calculation of figure of merit (FOM) displays a high value of 168, which is the highest among all the reported CuNW-based transparent electrodes. Meanwhile, the sheet resistance does not show great change after 10 tape tests and 10000 bending cycles, suggesting good adhesion to PET substrate and outstanding mechanical flexibility. Moreover, the composite transparent electrodes show a good stability to resist long-term storage and thermal environment.

中文翻译:

通过壳聚糖转变同步提高柔性铜纳米线网络的可靠性、品质因数和附着力

铜纳米线 (CuNWs) 是一种卓越的组件,由于其低成本、高导电性和可接受的透射率,可以替代氧化铟锡 (ITO) 作为透明电极。然而,由于产生松散连接的连接点,常见的涂层方法会导致较差的电气、光学和粘合性能。此外,不令人满意的热稳定性和环境稳定性也限制了实际应用。这些问题应该通过材料和工程方法在基于 CuNW 的薄膜中克服,以获得可靠的透明电极。在这项工作中,一种由壳聚糖和 CuNWs 组成的新型透明复合电极在柔性聚对苯二甲酸乙二醇酯 (PET) 基板上,具有同步增强的附着力,提高透光率,降低电阻率,提高柔韧性,增强的热稳定性和增强的环境稳定性,无需真空处理和高温退火即可制备。研究了CuNW网络层数和壳聚糖浓度对壳聚糖/CuNWs复合透明电极性能的影响。所得电极在 550 nm 处表现出优异的导电性(薄层电阻:15.6 Ω/sq.)和优异的光学透射率(~87%)。品质因数 (FOM) 的计算显示出 168 的高值,这是所有报道的基于 CuNW 的透明电极中最高的。同时,在 10 次胶带测试和 10000 次弯曲循环后,薄层电阻没有表现出很大的变化,表明对 PET 基材的粘附性良好,机械柔韧性出色。而且,
更新日期:2020-06-30
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