Abstract This work presents the evaluation of mixed-mode fracture toughness for an interface crack using molecular dynamics simulations. A Cu/Ag bimetallic structure with an interface crack was configured, where the atomic interactions were characterized based on the embedded-atom method potential. A bimaterial K-field of linear elastic fracture mechanics was employed as a remote loading for the mixed-mode failure. The traction ratio of the shear to normal component in front of a crack tip was defined as the mode mixity. The critical value of the J-integral for the onset of crack growth along the interface was measured as the interfacial fracture toughness; the value was also compared to the critical energy release rate and the Griffith fracture toughness. The interfacial fracture toughness of a Cu/Ag bimaterial was found to exhibit significant dependence on mode mixity for an interface crack, which resulted from various types of atomic-scale deformation at the interface.

中文翻译：

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通过原子模拟对 Cu/Ag 双金属界面进行混合模式断裂韧性测试

摘要 这项工作提出了使用分子动力学模拟评估界面裂纹的混合模式断裂韧性。配置了具有界面裂纹的 Cu/Ag 双金属结构，其中原子相互作用基于嵌入原子方法势进行表征。线弹性断裂力学的双材料 K 场被用作混合模式失效的远程载荷。裂纹尖端前剪切力与法向分量的牵引比定义为模态混合度。沿界面裂纹扩展开始的 J 积分临界值被测量为界面断裂韧性；该值还与临界能量释放率和格里菲斯断裂韧性进行了比较。