In this work, the isocyanate terminated castor oil based urethane oligomer (CO-IPDI) was prepared by the reaction of castor oil and isophorone diisocyanate (IPDI) without adding any organic solvent. After the acrylic copolymer pressure sensitive adhesive (PSA) was heated at 80 °C for 20 min, it was mixed with CO-IPDI, trifunctional acrylic monomer and photo-initiator in a certain proportion to give a UV-curable peelable adhesive for silicon wafer cutting process. Before UV irradiation, the acrylate copolymer chains were cross-linked by CO-IPDI to form a network. After UV irradiation, another polymer network formed by photo-polymerization of trifunctional acrylic monomer hold together with it to form an interpenetrating network (IPN) structure. The results showed that this IPN structured UV-curable peelable PSA had a high peeling strength of 13.99 N/25 mm before UV curing to meet the suggested requirements for silicon wafer cutting process. The peeling strength was significantly decreased to 0.49 N/25 mm after UV curing, and the tape was easily peeled off from wafer with about 0.96% residual adhesive estimated by the area ratio of all residual adhesive particles to silicon wafer observed by scanning electron microscopy. This work provides a new candidate idea for green and efficient preparation of UV-curable peelable PSA.

在这项工作中，通过蓖麻油与异佛尔酮二异氰酸酯（IPDI）的反应，无需添加任何有机溶剂，即可制得异氰酸酯封端的蓖麻油基氨基甲酸酯低聚物（CO-IPDI）。将丙烯酸共聚物压敏胶（PSA）在80°C下加热20分钟后，将其与CO-IPDI，三官能丙烯酸单体和光引发剂按一定比例混合，以制得可紫外固化的硅片可剥离胶切割过程。在紫外线照射之前，丙烯酸酯共聚物链通过CO-IPDI交联形成网络。紫外线照射后，通过三官能丙烯酸单体的光聚合反应形成的另一种聚合物网络与其保持在一起，形成互穿网络（IPN）结构。结果表明，该IPN结构的UV固化型可剥离PSA具有13的高剥离强度。UV固化前为99 N / 25 mm，以满足硅片切割工艺的建议要求。UV固化后，剥离强度显着降低至0.49N / 25mm，并且通过用扫描电子显微镜观察到的所有残留粘合剂颗粒与硅晶片的面积比估计，带容易从具有约0.96％残留粘合剂的晶片上剥离。这项工作为绿色高效制备可紫外线固化的可剥离PSA提供了新的候选方法。通过扫描电子显微镜观察到的所有残留粘合剂颗粒与硅片的面积比估算出96％残留粘合剂。这项工作为绿色高效制备可紫外线固化的可剥离PSA提供了新的候选方法。通过扫描电子显微镜观察到的所有残留粘合剂颗粒与硅片的面积比估算出96％残留粘合剂。这项工作为绿色高效制备可紫外线固化的可剥离PSA提供了新的候选方法。