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Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability
Journal of Electronic Materials ( IF 2.2 ) Pub Date : 2020-05-09 , DOI: 10.1007/s11664-020-08156-0 Marion Branch Kelly , Tapabrata Maity , A. R. Nazmus Sakib , D. R. Frear , Nikhilesh Chawla
中文翻译：
校正至：基板表面处理冶金学对无铅焊点微观结构的影响，对板级可靠性有影响
更新日期：2020-05-09
Journal of Electronic Materials ( IF 2.2 ) Pub Date : 2020-05-09 , DOI: 10.1007/s11664-020-08156-0 Marion Branch Kelly , Tapabrata Maity , A. R. Nazmus Sakib , D. R. Frear , Nikhilesh Chawla
In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1.
中文翻译：
校正至：基板表面处理冶金学对无铅焊点微观结构的影响，对板级可靠性有影响
在原始文章中，图1中存在错误。以下是更正后的图1。
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