Here, we study the effect of bonding time on the intermetallic compound (IMC) formation and shear property of Cu/In-50Ag/Cu TLP solder joints based on low-temperature transition liquid phase (TLP) bonding of In-Ag composite powder. The bonding process was carried out at a temperature of 260°C using a wafer bonding machine. The results show that the solder joints are composed of an (Ag,Cu)₂In phase and a Cu₂In phase in the interfacial diffusion reaction zone and an Ag₂In phase and In rich phase in the in␣situ reaction zone. It was observed that the (Ag,Cu)₂In phase is formed firstly in the diffusion reaction zone when the bonding time is 0.5 min, then transforms completely into the Cu₂In phase when the bonding time reaches 30 min. The shear strength increased and then decreased with increasing bonding time. The observed shear fracture mode of solder joints is brittle.

在此，我们研究了基于In-Ag复合粉末的低温过渡液相（TLP）键合，键合时间对Cu / In-50Ag / Cu TLP焊料接头的金属间化合物（IMC）形成和剪切性能的影响。使用晶片键合机在260℃的温度下进行键合工艺。结果表明，焊点在界面扩散反应区由（Ag，Cu）₂ In相和Cu ₂ In相组成，在原位反应区由Ag ₂ In相和In相富集组成。观察到，当键合时间为0.5 min时，首先在扩散反应区形成（Ag，Cu）₂ In相，然后完全转变为Cu ₂当粘合时间达到30分钟时同相。剪切强度随着粘结时间的增加先增加后降低。观察到的焊点剪切断裂模式很脆。