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Silicone Resin-Based Composite Materials for High Thermal Stability and Thermal Conductivity
Journal of Electronic Materials ( IF 2.1 ) Pub Date : 2020-05-08 , DOI: 10.1007/s11664-020-08194-8
Yi Liu , Zhenxing Chen , Yishen Qin , Yuqiu Shen , Yong Zhou , Dan Wang , Jiaxin Hu , Wenchao Feng

Insulated silicone/alumina (Al2O3) composites with high thermal stability and thermal conductivity were fabricated, in which the silicone resin was fabricated by a hydrolysis and condensation reaction with triethoxysilane (MTES), dimethyldiethoxysilane (DMDES) and phenyltrimethoxysilane (PhTMS). When the Al2O3 loading was 80 wt.%, the composite had only a 1.2% weight loss at 390°C. When the volume ratio of the 10 μm Al2O3 powder to 0.5 μm Al2O3 powder was controlled at 7:3, the silicone resin-based composite had thermal conductivity of 1.18 W m−1 K−1, which is 6.2 times as high as that of the pure silicone resin. Furthermore, the silicone/Al2O3 composite had dielectric strength of 87.5 kV mm−1.



中文翻译:

有机硅树脂基复合材料具有高热稳定性和导热性

制备了具有高热稳定性和导热性的绝缘硅/氧化铝(Al 2 O 3)复合材料,其中硅树脂是通过与三乙氧基硅烷(MTES),二甲基二乙氧基硅烷(DMDES)和苯基三甲氧基硅烷(PhTMS)水解和缩合反应制得的。当Al 2 O 3的负载量为80重量%时,该复合材料在390℃的重量损失仅为1.2%。当将10μm的Al 2 O 3粉末与0.5μm的Al 2 O 3粉末的体积比控制为7:3时,基于有机硅树脂的复合材料的热导率为1.18W m -1  K -1,是纯有机硅树脂的6.2倍。此外,有机硅/ Al 2 O 3复合材料的介电强度为87.5kV mm -1

更新日期:2020-05-08
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