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Preparation and Properties of Novel Cross-Linked Fluorinated Poly(aryl ether) with Low Dielectric Constant and High Thermal Stability.
Macromolecular Rapid Communications ( IF 4.2 ) Pub Date : 2020-05-27 , DOI: 10.1002/marc.202000100 Zhaoyang Wang 1 , Yunrui Xie 2 , Yingshuang Shang 1 , Da Xu 1 , Zilong Jiang 1 , Qinfei Xu 1 , Chenyi Zhou 1 , Haibo Zhang 1
Macromolecular Rapid Communications ( IF 4.2 ) Pub Date : 2020-05-27 , DOI: 10.1002/marc.202000100 Zhaoyang Wang 1 , Yunrui Xie 2 , Yingshuang Shang 1 , Da Xu 1 , Zilong Jiang 1 , Qinfei Xu 1 , Chenyi Zhou 1 , Haibo Zhang 1
Affiliation
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Fluorinated poly(aryl ether)s (FPAEs) have attracted much attention due to their high thermal stability, excellent mechanical strength, and low dielectric constant. High‐molecular‐weight fluorinated poly(aryl ether) containing phenylethynyl (FPAE‐PE) is successfully synthesized by nucleophilic substitution between 3‐ethynylphenol and FPAE. The cross‐linked fluorinated poly(aryl ether) (C‐FPAE‐PE) is prepared by thermal treatment of FPAE‐PE at 300 °C. The thermal stability, dynamic thermomechanical property, and dielectric performance of C‐FPAE‐PE are systematically studied. C‐FPAE‐PE has excellent heat resistance with 5% weight loss temperature (Td5%) at 490 °C in air and high thermomechanical properties with storage modulus retention of 50% at 215 °C. C‐FPAE‐PE displays low and steady dielectric constant of 2.4 and dielectric loss of 0.004 at 215 °C, exhibiting potential applications in the field of microelectronics, communication technology, and energy storage as high‐temperature low dielectric materials.
中文翻译：
低介电常数和高热稳定性的新型交联氟化聚芳醚的制备及性能。
氟化聚（芳基醚）（FPAE）由于其高的热稳定性，优异的机械强度和低的介电常数而备受关注。通过3-乙炔基苯酚和FPAE之间的亲核取代，成功合成了含苯基乙炔基（FPAE-PE）的高分子量氟化聚（芳基醚）。交联的氟化聚（芳基醚）（C-FPAE-PE）是通过在300°C下对FPAE-PE进行热处理而制备的。系统地研究了C-FPAE-PE的热稳定性，动态热机械性能和介电性能。C‐FPAE‐PE具有出色的耐热性，失重温度为5％（T d5％）在490°C的空气中和较高的热机械性能，在215°C下的储能模量保持50％。C-FPAE-PE在215°C时显示出稳定的低介电常数2.4和0.004的介电损耗，在微电子，通信技术和能量存储领域中作为高温低介电材料具有潜在的应用前景。
更新日期：2020-05-27
中文翻译：
低介电常数和高热稳定性的新型交联氟化聚芳醚的制备及性能。
氟化聚（芳基醚）（FPAE）由于其高的热稳定性，优异的机械强度和低的介电常数而备受关注。通过3-乙炔基苯酚和FPAE之间的亲核取代，成功合成了含苯基乙炔基（FPAE-PE）的高分子量氟化聚（芳基醚）。交联的氟化聚（芳基醚）（C-FPAE-PE）是通过在300°C下对FPAE-PE进行热处理而制备的。系统地研究了C-FPAE-PE的热稳定性，动态热机械性能和介电性能。C‐FPAE‐PE具有出色的耐热性，失重温度为5％（T d5％）在490°C的空气中和较高的热机械性能，在215°C下的储能模量保持50％。C-FPAE-PE在215°C时显示出稳定的低介电常数2.4和0.004的介电损耗，在微电子，通信技术和能量存储领域中作为高温低介电材料具有潜在的应用前景。
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